Optimization of Power Integrity and Signal Integrity Based on A Field-Circuit Combined Method
Since lumped circuit elements cant reflect effects of distributed parameters in the printed circuit board(PCB),this article uses electrometric computing software to calculate S parameters of the PCB and converts them into circuit models to perform field-circuit combined simulations,improving accuracy of power integrity(PI)and signal integrity(SI)analyze.Based on that,PCB decoupling network is analyzed using decoupling current and target impendence,and by optimizing PCB stack and drilling via holes at pads,decoupling network gets lower impendence,higher decoupling current and more suitable for high density designs.Moreover,characteristic impendence matching is achieved by adjustment of PCB stack.Simulation results show power supply ripple after optimization is reduced into desired level and optimized signal transmission is normal thus PI and SI are met.
Field-circuit combined method characteristic impendence decoupling network PCB stack lead inductance
Lei Zhou Qingxiang Liu Jianqiong Zhang Bangji Wang Xiangqiang Li
School of Physical Science and Technology Southwest Jiaotong University Chengdu,China
国际会议
重庆
英文
2309-2313
2017-03-25（万方平台首次上网日期，不代表论文的发表时间）