Finite Element Analysis of Failure Mode of Ceramic-Metal Package

摘要：

　　A 3D calculating model, according to 1JCQ200-1 contactor, was proposed to analysize the influence of residual stress to the faults in reliability of ceramic-metal package by using ANSYS finite element program.Through analysis in distribution of residual stress among fixed dectrode, ceramic and sealed ring, the result show that the residual stress of soldering had stress concentration, which concentrated on sealed ring.And this stress concentration easily led the crack in sealed ring.The paper gave the explanation of the fault which was because of the crack in sealed ring after soldering.And some advisements were proposed to improve the design of similar structure to avoid faults in reliability.

关键词： ceramic-metal package stress finite element method

作者: Xue Wang Jianxiong Qin

作者单位: Guilin Aerospace Electronics Co., Guilin 541002

会议类型: 国际会议

会议名称: The 6th Intrenational Conference on Reliability of Electrical Products and Electrical Contacts(第六届电工产品可靠性与电接触国际会议)

会议地点: 江苏常熟

会议语种:英文

页码: 192-195

在线出版日期: 2017-04-18（万方平台首次上网日期，不代表论文的发表时间）