The Trip Design of Overload Protection for MCCB Based on FEM Analysis

摘要：

　　This paper introduces the structure of the delay project of moulded case circuit breaker (MCCB) and the meaning of the thermal overload unit.This paper introduces the condition of FEM simulation technology of the trip unit in the MCCB.In the first, acquiring the result by accumulating under the constrain of the project is the basic condition to obtain the reliability of the thermal overload trip unit.The way is traditional,it is in rough ,but it gives the way to know the direction of the design.In the second, utilizing the elerticthermal-stucture pattern of the Ansys workbench do research on the thermal overload unit.It is more accurate than traditional way.Then acquiring the conclusion of the bimetal temperature distributing and the force in the condition of the conventional non-tripping (tripping) current.This example which has been applied in the enterprise proves the meaning of the research.

关键词： MCCB thermal overload trip unit bimetal simulation ANSYS Work Bench

作者: Weichun Tang Jionghua Wang Jianqing Gu Nairui Yin

作者单位: Changshu Switchgear Mfg.Co., Ltd.(Former Changshu Switchgear Plant), Changshu, 215500 Jiangsu key laboratory of smart grid distribution and utilization technology research, Changshu, 215500

会议类型: 国际会议

会议名称: The 6th Intrenational Conference on Reliability of Electrical Products and Electrical Contacts(第六届电工产品可靠性与电接触国际会议)

会议地点: 江苏常熟

会议语种:英文

页码: 339-343

在线出版日期: 2017-04-18（万方平台首次上网日期，不代表论文的发表时间）