Understanding Microstructural Evolution during Rapid Solidification of Undercooled AgCu Alloy

摘要：

Introduction Using the undercooling and rapid solidification technology can refine grain size and improve material properties.In this work, the evolution mechanism of solidification microstructure of undercooled Ag50Cu50 and Cug8Ag2 (.at) alloys is investigated, and the aim is to provide a new effective preparation process for high performance AgCu alloy.

作者: ZHANG Shunmeng KAI Xiong YONG Mao

作者单位: Yunnan Key Laboratory of Micro/Nano Materials & Technology,School of Materials Science and Engineering, Yunnan University, Kunming 650091, China

会议类型: 国际会议

会议名称: the 2016 International Seminar on Advanced Materials Research(2016先进材料研究国际研讨会)

会议地点: 昆明

会议语种:英文

页码: 433-434

在线出版日期: 2016-10-14（万方平台首次上网日期，不代表论文的发表时间）