Research Status of Copper Foil Surface Treatment and Development of Novel Process

摘要：

　　Surface treated copper foil and its preparation is very important and widely used.The science research and enterprise competition always focus on the surface treated methods in the copper foil field.This paper summarized the typical surface treated processes of copper foil, and emphasized on research progress and problems of copper foil surface treated processes.The brush plating-dealloying treated process of copper foil was proposed based on the problems.The principle and research status of new process was introduced.At last, the future development of surface treated process and application prospect were forecast.

关键词： Copper foil Surface treatment Research status New process development Brush plating Dealloying

作者: Wen-jing Wang Xue-feng Liu

作者单位: School of Materials Science and Engineering, University of Science and Technology Beijing, Xueyuan R School of Materials Science and Engineering, University of Science and Technology Beijing, Xueyuan R

会议类型: 国际会议

会议名称: The 2016 China Functional Materials Technology and Industry Forum (2016中国国际功能材料大会暨第九届中国功能材料及其应用学术会议)

会议地点: 重庆

会议语种:英文

页码: 43-51

在线出版日期: 2016-07-25（万方平台首次上网日期，不代表论文的发表时间）