High Performance Resistive Memory Devices Based on a Novel Soluble Polyimide Containing Triphenylamine Structure
Over the past decade, polyimide (PI) materials was applied to resistive memory device study largely because of their excellent thermal stability, chemical stability and mechanical properties.Compared to inorganic semiconductor materials, the organic polymer materials were easyprocessing, flexibility, low cost, etc.Thus, polyimide materials were considered to be used for the next generation electrical resistive storage application.
Lunjun Qu Yanren Zheng Yi Zhang Zhenguo Chi Siwei Liu Jiarui Xu
PCFM Lab, GD HPPC Lab, Guangdong Engineering Technology Research Centre for High-performance Organic and Polymer Photoelectric Functional Films, State Key Laboratory of Optoelectronic Materials and Technologies, School of Chemistry and Chemical Engineering, Sun Yat-sen University, Guangzhou 510275, China
国际会议
9th International Symposium on High-Tech Polymer Materials(第9届国际高技术高分子材料学术会议)(HTPM-9)
郑州
英文
97-98
2016-07-11(万方平台首次上网日期,不代表论文的发表时间)