Preparation and Properties of Polyimide Films with Low Coefficients of Thermal Expansion and Low Water Absorption
Polyimide (PI) films have been widely used in microelectronic and optoelectronic devices due to their good thermal stability, chemical stability, high insulation and excellent mechanical properties 1-3However, with the rapid development of technologies, the basic properties of PI films are increasingly unable to meet the actual requirements.In addition to the above mentioned basic properties, other combined properties of PI films have recently been proposed for higher demands, for example, higher glass transition temperatures (Tg), low coefficients of thermal expansion (CTE), low water absorption (WA) and higher modulus.It is generally known that augmenting the content of linear/rigid structure in the PI systems is beneficial to ameliorate in-plane orientation of the films, which can reduce the CTE value 4.At the same time, the increase of ester group content in PI systems is helpful to reduce the WA of the PI films 5.
Bin Jia Shi-yong Yang
Laboratory of Advanced Polymer Materials, Institute of Chemistry, Chinese Academy of Sciences,No.2, 1st North Street, Zhongguancun, Beijing 100190, China
国际会议
9th International Symposium on High-Tech Polymer Materials(第9届国际高技术高分子材料学术会议)(HTPM-9)
郑州
英文
163-164
2016-07-11（万方平台首次上网日期，不代表论文的发表时间）