Synthesis and Characterization of Benzobisoxazole-based Block Copolyimides with Low Coefficient of Thermal Expansion
Aromatic polyimide (PI) films constitute an important class of materials in high-performance electronics packaging and optoelectronic applications, primarily due to their desirable combination of properties which include excellent thermoxidative stability, high mechanical strength, high modulus,superior chemical resistance and relatively low dielectric constants1.A recent strong requirement for practical applications mentioned is dimensional stability of adhesive-free PI film/Cu laminates (Flexible Copper Clad Laminates, FCCL) to suppress thermal stress build-up during thermal processing/cycling of silicon-conductor chips bonded to the PI films2.In this regard, the linear coefficient of thermal expansion (CTE) along the film plane direction should be precisely controlled to approximate to that of the copper foil (CTE=1 8ppm/K).The most efficient and empirical way to develop low-CTE PIs is introduction of rod-like group into backbones, which could entail ordered and close arrangement of chains facilitating the thermal imidization-induced self-orientation alignment to the film plane direction3.
Lili Yuan Mian Ji Shiyong Yang
Laboratory of Advanced Polymer Materials, Institute of Chemistry, Chinese Academy of Science,Beijing 100190, P.R.China
国际会议
9th International Symposium on High-Tech Polymer Materials(第9届国际高技术高分子材料学术会议)(HTPM-9)
郑州
英文
165-166
2016-07-11（万方平台首次上网日期，不代表论文的发表时间）