Development of Intrinsically Heat-sealable Polyimides with High Thermal Resistance
Among diverse applied forms of polyimides (PIs), films are a class of products that are usually fabricated from linear PIs with high property-tailorability by structure design, which have achieved great success in many high-tech areas 1, 2.In practice, it is generally needed that PI films adhere to themselves or other materials to form large-scaled or composite configurations.Under these conditions, adhesion is an important fact for the serviceability of PI films.However, the lack of active functional groups at the surfaces together with low surface free energy generally deteriorates the adhesive characteristics.
Hong-jiang Ni Jin-gang Liu Shi-yong Yang
Laboratory of Advanced Polymer Materials, Institute of Chemistry, Chinese Academy of Sciences, P.R.China
国际会议
9th International Symposium on High-Tech Polymer Materials(第9届国际高技术高分子材料学术会议)(HTPM-9)
郑州
英文
172-174
2016-07-11（万方平台首次上网日期，不代表论文的发表时间）