Preparation and Properties of Soft-Rod Block Copolyimide Films via Chemical and Thermal imidization
Aromatic polyimide (PI) films have been widely used in the field of microelectronic manufacturing and packaging, optoelectronic devices and aeronautic industries, due to their excellent properties including superior thermal stability, outstanding mechanical properties, high electrical resistivity and low relative dielectric constants1.Owing to their insolubility in common solvents and infusibility below decomposition temperature, aromatic PI films are usually processed through its precursor-polyamic acid via chemical or thermal imidization.The principal advantage of chemical imidization is that it does not cause the degradation of polyamic acids in amide solvents, even at high temperatures of 140 to 150℃, and the reaction proceeds at rather high rates at room temperature2, 3.However, effects of chemical imidization on aggregation structure, mechanical and thermal properties of P1 films have not yet been intensively investigated.
Zhen-he Wang Shi-yong Yang
Laboratory of Advanced Polymer Materials,Institute of Chemistry, Chinese Academy of Sciences, Beijing 10080, P.R.China
国际会议
9th International Symposium on High-Tech Polymer Materials(第9届国际高技术高分子材料学术会议)(HTPM-9)
郑州
英文
175-177
2016-07-11（万方平台首次上网日期，不代表论文的发表时间）