Synthesis and Characterization of Low-CTE Polyimide Films Containing Trifluoromethyl Groups with Low Moisture Adsorptivity
Aromatic polyimide (API) films have been extensively used to produce two-layer flexible copper clad laminate (2L-FCCL) for fabrication of Flexible Printed Circuits (PFC) due to their combined excellent properties 1.However, the common API films usually have coefficient of thermal expansion (CTE) values (35-50 ppm/K), much higher than that of copper foil (17.8 ppm/K).The CTE mismatching between API films and the copper foil might result in serious troubles when FPC was produced at elevated temperatures2-3.Thus, reducing API films CTE value close to copper foil has been a key issue for successful high-density flexible electronic applications.
Wei Chen Mian Ji Shiyong Yang
Laboratory of Advanced Polymer Materials, Institute of Chemistry, Chinese Academy of Sciences,Zhongguancun, Beijing, 100190, China
国际会议
9th International Symposium on High-Tech Polymer Materials(第9届国际高技术高分子材料学术会议)(HTPM-9)
郑州
英文
178-180
2016-07-11（万方平台首次上网日期，不代表论文的发表时间）