Creep Characteristic of Sn1.0Ag0.7Cu Lead-Free Solders with Element Addition

摘要：

　　In this study,creep properties of lead-free solders based on Sn1.0Ag0.7Cu were investigated.In the solders,germanium,nickel and bismuth were added to improve their mechanical properties.The effect of element addition on their microstructure and creep properties were studied.Creep properties were improved with the element addition.Creep rupture lifetime was the longest for SnAgCuBiNiGe,and that of SnAgCuBi was the second longest.It was made clear that a minimum creep strain rate is useful for lifetime prediction of the solders.An observation of microstructure was performed and coarsening of intermetallics after creep test was identified,resulting in creep rupture.It was found that the addition of bismuth hinders the coarsening of intermetallics and is effective to improve the creep properties of the solders.

关键词： Lead-free solder Creep Microstructure Life prediction

作者: Fumio Ogawa Hiroki Nagao Takamoto Itoh Masao Sakane Mitsuo Yamashita Hiroaki Hokazono

作者单位: Department of Mechanical Engineering,College of Science and Engineering,Ritsumeikan University,1-1-1 Graduate School of Ritsumeikan University,1-1-1 Nojihigashi,Kusatsu-shi,Shiga,Japan Fuji Electric Co.,Ltd.,11-2,Ohsaki 1-chome,Shinagawa,Tokyo,Japan

会议类型: 国际会议

会议名称: 2016 International Symposium on Structural Integrity，ISSI—2016(2016国际结构完整性研讨会)

会议地点: 天津

会议语种:英文

页码: 192-196

在线出版日期: 2016-05-26（万方平台首次上网日期，不代表论文的发表时间）