Mismatch Constraint Effect for Bimaterial Interfacial Creep Crack

摘要：

　　Mismatch effect of weldments is important for the assessment of structural integrity at elevated temperature.The interfacial creep crack is a common model which can be found in lots of engineering practices.Recently,the constraint effect is also considered to be significant for the evaluation of creep crack growth under high temperature.In this paper,a model for bimaterial interfacial creep crack is introduced to study the mismatch constraint effect.The stress field for bimaterial interfacial creep crack is investigated.An M*-parameter is proposed to characterize the constraint effect caused by material mismatch for bimaterial creep crack.A comparison is made between the geometry constraint caused by specimen loading and mismatch constraint caused by inhomogeneous material.

关键词： Creeping mismatch Constraint effect Bimaterial interfacial crack M*-parameter

作者: Yanwei Dai Yinghua Liu Haofeng Chen

作者单位: Department of Engineering Mechanics,AML,Tsinghua University,Beijing 100084,China Department of Mechanical & Aerospace Engineering,University of Strathclyde,Glasgow,G1 1XJ,UK

会议类型: 国际会议

会议名称: 2016 International Symposium on Structural Integrity，ISSI—2016(2016国际结构完整性研讨会)

会议地点: 天津

会议语种:英文

页码: 286-290

在线出版日期: 2016-05-26（万方平台首次上网日期，不代表论文的发表时间）