Characterization of High-Power COB LED Module Attached by Low-Temperature Sintered Nanosilver
Along with the increasing demand of high power LED (>1W),multi-chip modules have made great progress to an inevitable trend.Thus,large packaging area is needed to dissipate heat efficiently.Obviously,a die-attach layer as the first-level packaging has a most significant impact on the thermal performance of a power module.So we introduce a novel die-attach material,nanosilver paste,which can be used for connecting multi-chips on the substrate because of its higher melting temperature and better thermal/electrical conductivity than conventional solders and adhesive films.What is more important,LED packages are being exposed to harsher environments,so the performance and stability of LED packages will be the key to assuring the reliable function of systems.So,in this paper,the optical and electrical properties of the LED device operating under various ambient temperatures from 27 to 120℃ were determined.The test results showed that nanosilver paste was a very promising die-attach material in high power multi-chip modules packaging.
High Power LED COB Packaging Nanosilver Paste High Temperature Reliability
Jia Chen Xin Li Ya-Fei Kong
School of Material Science and Engineering,and Tianjin Key Laboratory of Advanced Joining Technology,Tianjin University,Tianjin,P.R.China
国际会议
2016 International Symposium on Structural Integrity，ISSI—2016(2016国际结构完整性研讨会)
天津
英文
389-393
2016-05-26（万方平台首次上网日期，不代表论文的发表时间）