Purity and Grain Size Effects of Creep Characteristics of Pure Aluminum for Electric Devices
This paper describes creep property of high purity aluminums in high temperature.Power devices which have been developed are operated under higher temperature more than 473K.Silicon, solder and basal plate experience thermal expansion and thermal stress because of their difference coefficients of thermal expansion.This is the cause for breakdowns and problems of electronic devices.Aluminums are used for electronic devices because aluminums tend to deform easily which takes a role to mitigate thermal stress.Aluminums improve ductility and electrical conduction property by improving their purity.From these facts, it is important for electronic devices design to reveal creep property of aluminums.This study has a purpose to present creep property of aluminums under high temperature environment and to elucidate the effect of purity and grain size on creep property.The creep tests were performed using three types of purity aluminums and two types of grain size aluminums.From the results, it was clear that creep strength is reduced by higher purity resulting from increase in the creep strain rate.Larger grain size also reduce the creep strength.
Purity Grain size Thermal stress Creep rupture Creep deformation Creep ductility
Norihiko Osada Shogo Yoshitake Fumio Ogawa Takamoto Itoh Masao Sakane
Graduate School of Science & Engineering, Ritsumeikan University,1-1-1 Nojihigashi, Kusatsu-shi, Shi Department of Mechanical Engineering, College of Science & Engineering Ritsumeikan University, 1-1-1
国际会议
长沙
英文
38-42
2016-10-16（万方平台首次上网日期，不代表论文的发表时间）