A Comparison among Dry Laser Ablation and Some Different Water-laser Co-machining Processes of Single Crystal Silicon Carbide

摘要：

　　Single crystal silicon carbide (SiC) is a new semiconductor material that has a great potential to be widely used.However, SiC is a kind of difficult-to-machine material due to its extreme hardness and brittleness.The present study investigated the machinability of single crystal SiC using dry laser and three different water-laser co-machining processes.The results indicate that using the hybrid laser-waterjet micro-machining to micro-groove single crystal SiC can derive the clean and straight edges and thermal-damage-free grooves.

关键词： Single crystal silicon carbide Dry laser ablation Under-water laser machining Low-pressure waterjet assisted laser machining Hybrid laser-waterjet micro-machining

作者: Shaochuan Feng Chuanzhen Huang JunWang Hongtao Zhu Peng Yao Liang Wang

作者单位: Center for Advanced Jet Engineering Technologies (Ca JET), Key Laboratory of High-efficiency and Clean Mechanical Manufacture (Ministry of Education), School of Mechanical Engineering,Shandong University, Jinan, China, 250061

会议类型: 国际会议

会议名称: The 12th Asia-Pacific Conference on Materials Processing(APCMP2016)(第12届亚太材料加工会议)

会议地点: 青岛

会议语种:英文

页码: 3-8

在线出版日期: 2016-06-16（万方平台首次上网日期，不代表论文的发表时间）