Study on Slurry of Chemical Mechanical Polishing 304 Stainless Steel Based on Ferric Chloride and Oxalic Acid
Stainless steel will become one of the substrate materials used in flexible display.In this paper, the influence of the ferric chloride and the oxalic acid on the material removal rate (MRR) and surface roughness had been studied in the chemical mechanical polishing (CMP) 304 stainless steel.By analysis and research, the slurry ingredients based on the type of ferric chloride and oxalic acid had been obtained.The experimental results show that, the material removal rate reached more than 200nm/min.By the qualitative analysis on the phases of the surface material of 304 stainless steel using X-ray diffraction (XRD) after CMP, it is proved that the ferric chloride based slurry did not change the original phases and did not affect the performance of 304 stainless steel.The research results of this paper can provide the reference for the study the CMP slurry of 304 stainless steel.
304 stainless steel Polishing slurry Oxidizing agent Chemical mechanical polishing Material removal rate
Jianxiu Su Jiapeng Chen Qing Li Hongquan Qin
Henan Institute of Science and Technology, Xinxiang, P.R.China, 453003 Henan Polytechnic University, Jiaozuo, P.R.China, 454000
国际会议
The 12th Asia-Pacific Conference on Materials Processing(APCMP2016)(第12届亚太材料加工会议)
青岛
英文
102-107
2016-06-16（万方平台首次上网日期，不代表论文的发表时间）