Laser-assisted waterjet micro-grooving of silicon wafers for minimizing heat affected zone

摘要：

　　Laser-assisted waterjet micro-machining can significantly reduce the thermal damages to the workpiece as compared to the traditional laser machining process, and hence can overcome the problems associated with laser machining, such as the formation of heat-affected zone, which is a serious issue for thermal sensitive and functional materials.An experimental study on micro-grooving of monocrystalline silicon wafers is reported in this study to explore the effects of process parameters on the groove depth and width as well as the heat-affected zone (HAZ) width.Predictive models based on dimensionl analysis are then developed for estiamting the groove characteristics.

关键词： Silicon wafers Laser-assisted waterjet Microgrooving Heat-affected zone

作者: Xiangning Pan Chuanzhen Huang Jun Wang Hongtao Zhu Peng Yao

作者单位: Center for Advanced Jet Engineering Technologies (CaJET), Key Laboratory of High-efficiency and Clean Mechanical Manufacture (MOE), School of Mechanical Engineering, Shandong University,Jinan, China

会议类型: 国际会议

会议名称: The 12th Asia-Pacific Conference on Materials Processing(APCMP2016)(第12届亚太材料加工会议)

会议地点: 青岛

会议语种:英文

页码: 133-138

在线出版日期: 2016-06-16（万方平台首次上网日期，不代表论文的发表时间）