Thermal Effect Characterization of Multiple Finger Power HBT:Thermal Resistance Matrix
The thermal resistance model of multi-finger HBTs is established,and then the expressions of self-heating thermal resistance and coupling thermal resistance are derived.Self-heating thermal resistance is used to characterize the self-heating effect,coupling thermal resistance is used to characterize the thermal coupling effect,furthermore,thermal resistance matrix is used to characterize the thermal effect of multi-finger HBT s.Results show that thermal resistance matrix can be used to characterize the thermal effect of multi-finger HBT,and the temperature distribution of HBT can be got by the thermal resistance distribution.
Heterojunction bipolar transistors Thermal resistance Emitter finger spacing
Chen Liang
School of Physics and Electronic Engineeing,Taishan University,Taian,271000;Hongan Group Co.,Ltd,Wendeng,264400;School of Physics,Shandong University,250100
国际会议
重庆
英文
182-185
2016-03-20（万方平台首次上网日期，不代表论文的发表时间）