Influence of Sintering Silica on Thermal Conductivity of Ultra-temperature Vacuum Insulation Panel
C/SiC layered composite was used as sealing material for ultra-temperature vacuum insulation panel (UT-VIP) due to its thermal stability and oxidation resistance.In order to minimize the thermal conductivity of the panel,a vacuum condition is required inside the panel.Chemical vapor infiltration (CVI) is usually used to fabricate C/SiC composite.However,it is very difficult to infiltrate the pores completely in CVI process.As a consequence,the emergence of these flaws incapacitates C/SiC layered composite to create a vacuum condition inside the panel.In this paper,SiO2 high temperature vacuum sintering was introduced in filling the inevitable pores and cracks that remained in the composite after the CVI process.Experimental result shows that pores between fiber bundles and cracks in the SiC matrix were filled with sintered silica The thermal conductivity of ultra-temperature vacuum insulation panel was significantly decreased owing to its low inside pressure created by the fully dense sealing material.
C/SiC composite thermal conductivity silica vacuum sintering
Yu Shengjie Chen Zhaofeng Wang Yang
Suzhou Superlong Aeronautical Heat-resistance Materials Co.ltd., Taicang, 215400, P.R.China;Super In Super Insulation Composite Laboratory, College of Materials Science and Technology, Nanjing Universi
国际会议
The 12th International Vacuum Insulation Symposium (IVIS 2015)(第十二届国际真空绝热材料会议)
南京
英文
241-244
2015-09-01（万方平台首次上网日期，不代表论文的发表时间）