Circuit Model and Analysis of Antenna-in-Package

摘要：

　　This letter presents a circuit model of the antenna-in-package (AiP) employing the via holes to connect the antenna ground and the system ground.A dosed-form expression for the inductance of ground via b provided in ease that two ground vias are arranged under the non-radiating edge of the AiP.The new expression takes account of the radius and length of the vias, the relative positions of the vias and the distances between the vias and the feed point of the antenna.Then, the influences of the vias on the performance of the AiP are analyzed using the model.It b found that the bandwidth of the AiP can be improved effectively by properly arranging two via holes under the non-radiating edge of antenna.The simulated results agree with the modeled results.

关键词： Antenna-in-package equivalent circuit RF transceiver via holes

作者: Li Li Wenmei Zhang

作者单位: College of Physics and Electronics Engineering,Shanxi University,Shanxi,030006,China

会议类型: 国际会议

会议名称: 2013 International Symposium on Antennas and Propagation(2013天线与传播国际会议)

会议地点: 南京

会议语种:英文

页码: 641-644

在线出版日期: 2013-10-23（万方平台首次上网日期，不代表论文的发表时间）