Transmission Characteristics of Via Holes in High-Speed PCB

摘要：

　　A method of analyzing transmission characteristics of via holes in the time domain is presented in this paper.A suitable analysis model is set up using CST (Computer Simulation Technology).With theoretical analysis, the effect of via structures on signal transmission characteristics could be acquired.The simulation results show that appropriate design for via holes can reduce transmission characteristics issues effectively.

作者: He Xiangyang Lei Zhenya Wang Qing

作者单位: School of Electronic Engineering, Xidian University Xian Shaanxi 710071, China

会议类型: 国际会议

会议名称: 2013 International Symposium on Antennas and Propagation(2013天线与传播国际会议)

会议地点: 南京

会议语种:英文

页码: 977-980

在线出版日期: 2013-10-23（万方平台首次上网日期，不代表论文的发表时间）