Chip-Level Interconnections Realized Via the Laser-Induced Forward Transfer Technique

摘要：

　　In this paper,successful flip-chip bonding and DC characterization of single photodiode and VCSEL chips via Laser-Induced Forward Transfer (LIFT) printed micro-bumps of indium,silver nano-particle (AgNP) based inks and pastes,is reported.

作者: K.S.Kaur J.Missinne G.Van Steenberge

作者单位: Centre for Microsystems Technology,imec/Ghent University,Technologiepark 914A,B-9052 Gent,Belgium

会议类型: 国际会议

会议名称: 2014 Asia Communications and Photonics Conference(ACP2014)(2014亚洲通信与光子学大会)

会议地点: 上海

会议语种:英文

页码: 1-3

在线出版日期: 2014-11-11（万方平台首次上网日期，不代表论文的发表时间）