Package Yield Enhancement Using Machine Learning in Semiconductor Manufacturing

摘要：

　　The production difficulty of the DRAM family has rapidly increasing.Several factors can be adduced to explain.For example,increasing of step in the production process by the miniaturization of semiconductor process,challenges of Low-power designed due to the growth of mobile family.And the two are connected by a combination of the result.It may increase the difficulty of an analysis of the test area for the yield improvement.This study analyzed the Fab measurement Data,Wafer Test Data,Package Test Data and looked at Package Yield Improvement.It covered Data pre-processing,Feature Selection,and then verify the relevant data,to derive an optimized relationship,and the actual production process applied too.

关键词： High Speed Test Package Yield Machine Learning Feature Selection Yield Prediction

作者: Hyoung gun Kim Young Shin Han Jee-Hyong Lee

作者单位: Sungkyunkwan University Suwon, Republic of Korea Sungkyul University Anyang, Republic of Korea

会议类型: 国际会议

会议名称: 2015 IEEE Advanced Information Technology, Electronic and Automation Control Conference(IAEAC 2015)(2015 IEEE先进信息技术,电子与自动化控制国际会议)

会议地点: 重庆

会议语种:英文

页码: 316-320

在线出版日期: 2015-12-19（万方平台首次上网日期，不代表论文的发表时间）