Hoop Stress development on Silicon Dioxide liner in Through Silicon Via

摘要：

　　Through Silicon Via Interconnects are usually protected with liners.A research on liners was done and conclusion made that they experience reliability problems like hoop stress which put them and the Through Silicon Via in danger.Simulation using Analysis Software was done on Silicon Dioxide liner.A Through Silicon Via of internal radius five micrometers,silicon liner of thickness two micrometers and height one micrometer was used.The liner was subjected to an internal pressure of one thousand micro Pascal.From mechanical Analysis System Parametric Design Language fourteen,it was confirmed that hoop stress surely exists in liners and ways should be proposed to protect them alongside the Through Silicon Via.

关键词： silicon dioxide liner through silicon via interconnect reliability analysis system

作者: Juma Mary Atieno Xuliang Zhang He Song Bai

作者单位: University of Electronic Science and Technology of China Chengdu, China

会议类型: 国际会议

会议名称: 2015 IEEE Advanced Information Technology, Electronic and Automation Control Conference(IAEAC 2015)(2015 IEEE先进信息技术,电子与自动化控制国际会议)

会议地点: 重庆

会议语种:英文

页码: 489-493

在线出版日期: 2015-12-19（万方平台首次上网日期，不代表论文的发表时间）