Variations in Hoop Stresses among Silicon Dioxide, Polystyrene and Polypropylene Carbonate Through Silicon Via Liners
Through Silicon Via are the widely used interconnects in the semiconductors industry. They are designed in different ways to meet the market demands. These interconnect need protection from both internal and external pressures. The pressures result from heating of the components on the chip which enhances expansion and contraction. Silicon dioxide has been the commonly used Through Silicon Via liner. We propose the use of polystyrene and polypropylene carbonate as liners to reduce overdependence on silicon dioxide. We compare deformations and stresses among the materials and noted that silicon dioxide had the least deformation and hoop stress values. We did further research and realized that the latter two materials have some good properties not found in silicon dioxide so they can also serve as better liners.
Analysis System Interconnect Liner Reliability Through Silicon Via
Juma Mary Atieno Xuliang Zhang He Song Bai
University of Electronic Science and Technology of China, Room A1-406, Main Building, No.2006, Xiyuan Ave, West Hi-Tech Zone, 611731 Chengdu, China
国际会议
重庆
英文
1089-1092
2015-12-18（万方平台首次上网日期，不代表论文的发表时间）