Research on Failure and Lifetime Prediction for IGBT Power Module
IGBT power module fail due to operating in high voltage, high current and high-frequency switching state for long time, frequently start and stop cause the power modules shell temperature changes significantly, the deformation under stress come up due to the different expansion coefficient of the module base plate bottom solder between the different layers, the deformation under stress accumulation is the result of the solder layer cracking, making the thermal resistance at the bottom of silicon chips increases, the junction temperature changes a lot.IGBT power module has long suffered thermal mechanical stress damage, and to accumulate and lead to fail in the end.The basic analysis method of fatigue damage and lifetime prediction, the fatigue cumulative damage theory and statistical counting method, to compare and analysis of the current multiple fatigue damage accumulation theory and statistical method, based on the fatigue cumulative damage theory and rain-flow count method, fatigue lifetime prediction of power module of data processing, summarize the characteristics of fatigue damage, deeply realize the influence of different operating conditions of power module lifetime.
IGBT Power Module fail lifetime prediction
He wang Ruihua Cui
Hebei industrial university institute of electrical appliances Hebei institute of electronics Tianjin, China
国际会议
温州
英文
411-416
2014-11-16（万方平台首次上网日期，不代表论文的发表时间）