Simultaneous measurement of in-plane and out-of-plane deformation using dual-beam spatial-carrier digital speckle pattern interferometry
Digital speckle pattern interferometry (DSPI) is an advanced technique for both in-plane and out-of-plane deformation measurements of diffuse surfaces in nano-scale.It has been widely used in aerospace engineering and other high-tech industries due to the advantages of non-contact, high-accuracy and full-field measurement.Traditionally, DSPI uses temporal phase shifting method to achieve precise deformation measurement, but it is only suitable for quasi-static deformation.Spatial-carrier method is another effective phase retrieval method used in DSPI and its validity has been verified in some DSPI setups.DSPI with spatial-carrier method enjoys the advantages of simple optical arrangement, easy operation, and above all, high-speed measurement of deformation.This paper introduces a dual-beam spatial-carrier digital speckle pattern interferometry system, with which in-plane and out-of-plane deformations can be measured simultaneously as well as quickly.In the optical setup, two lasers are employed to illuminate the measured object with different illumination angles, and two single-mode fibers server as carriers to transmit the reference beams.In-plane and out-of-plane deformations can be obtained by combining the phase maps of both channels.Theoretical discussion and experimental analysis are both presented.
In-plane deformation Out-of-plane deformation Digital speckle pattern interferometry Spatial-carrier Dynamic measurement
Kai Liu Sijin Wu Lianxiang Yang
Beijing Information Science & Technology University, Beijing, China Oakland University, Rochester, USA
国际会议
北京
英文
386-396
2014-10-19（万方平台首次上网日期，不代表论文的发表时间）