Grain growth kinetics behavior of SiCp reinforced Mg matrix composite during thermal treatment process
One kind of bimodal size SiCp/AZ91 composite was fabricated by stir casting and then it was subjected to forging and subsequent extrusion.After that the composite was thermal treated at the temperature of 543K-743K.Results show that the existence of SiCp has significant effect on microstructure stability of Mg matrix.The grain growth kinetics of as-extruded bimodal size SiCp/AZ91 composite are investigated by the kinetic equation Dn-Dn0 =kt.Due to the occurrence of static recrystallization, the average grain size do not increase lineally with increasing temperature and time.By ignoring the recrystallized grains, remarkable lower grain growth activation energy is obtained, which is thought to be the higher atomic mobility at non-equilibrium grain boundaries.
magnesium matrix composite thermal treatment SiCp grain growth active energy
DENG K.K. LI J.C. NIE K.B.
College of Materials Science and Engineering, Taiyuan University of Technology, Taiyuan 030024, PR China
国际会议
北京
英文
476-480
2014-10-11(万方平台首次上网日期,不代表论文的发表时间)