Drop-on-demand jetting of piezoelectric diaphragm-piston for fabricating precision solder bumps
Aiming at producing highly uniform ultra-small solder bumps to meet the growing requirements in the area array package,a novel fabrication method based on piezoelectric diaphragm-piston droplet jetting was proposed.The principle and customized equipment of this method were introduced.Solder bumps with a diameter less than 100 mm were successfully fabricated with the customized equipment.The main control parameters,such as voltage amplitude,pulse duration and the nozzle diameter,were studied to investigate their impact on the diameter of the solder bumps.The experimental results show that,while the voltage amplitude of the piezoelectric ceramic is within the range of 31 V~34 V and the pulse duration is within the range of 0.3 ms~0.5 ms,the device can perform stable single droplet jetting,and the droplets diameter will increase as the nozzle diameter becomes larger.
area array package solder bumps drop-on-demand jetting piezoelectric diaphragm-piston
Long He Xingfang Wei Honghai Zhang Peng Chen Hao Luo Ming Ma Sheng Liu Xiayun Shu
Division of MOEMS,Wuhan National Laboratory for Optoelectronics,School of Mechanical Science and Engineering,Huazhong University of Science & Technology Wuhan China
国际会议
The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)
成都
英文
10-13
2014-08-12（万方平台首次上网日期，不代表论文的发表时间）