Fabrication and Measurement of BPF using IPD Technology

摘要：

　　Band-pass-filters(BPF)are critical components in the RF modules.Conventional discrete component solutions,like those from discrete SMDs or LTCC(Low temperature co-fired ceramic)technology.Typically,these passive components consume 60%-70%of the footprint area.As miniaturization is becoming a trend for cost-reduction of wireless products,there is a need to make these devices in smaller form-factors.Integrated passive devices(IPDs)have attracted much attention in recent years,primarily due to the need of handheld and wireless devices to further decrease in cost and size and increase in functionality.

关键词： BPF LTCC IPDs wireless

作者: Bian Xinhai Guo Hongyan Zhang Li KH Tan CM Lai

作者单位: Jiangyin Changdian Advanced Packaging Co.,Ltd,JiangYin 214431,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 36-38

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）