Analysis on Electromagnetic Isolation Issues Among Multi-chips in System in Package

摘要：

　　Electromagnetic isolation is a critical issue to the performance of radio frequency system in package(RF SIP).This paper proposes a novel structure to measure the electromagnetic(EM)isolation property and to test the shield efficiency of a metal cap.The 3-dimensional structure contains 5 antenna chips assembled is based on rigid and flexible substrates.EM interference and EM isolation relevance with different distances is revealed with ideal antenna simulation results in order to eliminate the parasitic effects.EM isolation properties in different horizontal distances are measured between different chips.Moreover,EM isolation properties in different vertical distances are measured using a structure like a pulley block.This paper also demonstrates EM isolation properties of a shield structure with a metal cap.The test results show the shield efficiency of a metal cap reaches more than 50dB.These results are constituent with the simulation results simulated by HFSS,a 3-dimensional electromagnetic field simulation software.

关键词： Electromagnetic isolation RF SIP Rigid and Flexible substrates Shield Structure

作者: Peng Wu Fengman Liu Yi He Huimin He Jun Li Liqiang Cao Dongkai Shangguan Lixi Wan

作者单位: National Center for Advanced Packaging,Wuxi,China Institute of Microelectronics,Chinese Academy of Sciences,Beijing,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 53-57

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）