Study on the POP ceramic package multilayer board design

摘要：

　　In this paper,multilayer ceramic board design about the POP ceramic package is studied.Stripline design such as signalline,electrical wire,offset is optimized with software such as Cadence and HFSS.Signalline transfers loss i s obtained as 0.35dB/2GHz(25mm),electromagnetism isolation larger than 70dB.The complexity circuitry design for transfers loss signal delay electromagnetism isolation is satisfied.The result has significance affect on multilayer board design of POP ceramic package.

关键词： POP ceramic package multilayer ceramic board transfers loss electromagnetism isolation

作者: Zhang Jie Wang Ke

作者单位: The 13th research institute of CETC Shijiazhuang,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 62-65

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）