Multilayer Chip Embedded based on the Organic Substrate

摘要：

　　this paper mainly does research about the multilayer chip embedded based on the organic substrates.On the one hand,that puts forward a new 3D package structure of the organic substrates embedded.On the other hand,we find a kind of process flow based the whole organic substrate process and solve the key process.We completed the sample and test of the single-layer chip based the multilayer chip embedded structure.The structure realizes the high integration density 3D package based the chip embedded.That has some advantage of the package size,the electrical performance,the cost and the thermal management performance,etc.That can shorten the distance between the chip interconnection to improve the transmission performance.That can have the electromagnetic shielding effect and improves the EMC performance in the embedded system.In the process,we have done the package sample using the embedded substrate through the process and using the mature and lowcost organic substrate and micro package process and verify multilayer chip embedded process feasibility.The sample has passed tentative E-test and reliability test of reflow.

关键词： embedded process multilayer chip Performance

作者: Xueping Guo Zhongyao Yu Liqiang Cao Yang Song Yu Sun Zhidan Fang Hu Hao Guowei Ding

作者单位: National Center for Advanced Packaging(NCAP China)Wuxi China;Institute of Microelectronics of Chinese Academy of Sciences Beijing China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 66-69

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）