Influence of Cu Orientation on the Growth of Cu-Sn Intermetallics and Interfacial Reaction of Cu/Sn Diffusion Couple

摘要：

　　The copper substrates with different preferred orientations(200)and(220)were prepared and the interfacial reactions of the Cu(200)/Sn and Cu(220)/Sn diffusion couples were studied after annealing at 423K.The thickness and morphology of the intermetallic compounds were investigated.The appearance of the Cu3Sn was observed at Cu(220)/Sn interface after aged for 4 hours and then the thickness of Cu3Sn grown quickly.There is less Cu3Sn at Cu(200)/Sn interface but the Cu6Sn5 grown quickly and quantities of voids gathered into cracks.The preferred orientations of the Cu substrates are believed to be the reasons of the different interfacial reactions phenomena.

关键词： orientation interfacial reactions electroplate

作者: Shan Yang Li Peng Yishi Tao Anmin Hu Ming Li

作者单位: State Key Laboratory of Metal Matrix Composites,School of Material Science and Engineering,Shanghai Shanghai Entry-Exit Inspection and Quarantine Bureau,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 121-124

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）