Fast Time Domain Crosstalk Analysis of Through Silicon Vias Based On Equivalent Circuit Model

摘要：

　　Three-dimensional(3D)integration has been considered as the most promising method to overcome the interconnection bottleneck with through-silicon vias(TSVs)served as vertical signal channels.Three-dimensional integrated circuits(3D IC)meet the demands of high throughput,high scalability and low power consumption for future generation integrated circuits.Crosstalk is the dominant problem in signal integrity.While TSVs are bundled together as a cluster,the crosstalk coupling noise may lead to transmission errors.In this paper,we study several influencing factors of the crosstalk in the TSVs.Variations of space between two TSVs nets,different rise time of an attacking signal,various TSV stacking layers and three different types of communication models are modeled and analyzed to master their effect on the TSVs crosstalk.In order to verify the influence factors above,this paper proposes an equivalent electrical model of TSVs for crosstalk.

关键词： TSVs 3D Ic Crosstalk

作者: Zhilong ZHANG Runiu FANG Guanjiang WANG Xin SUN Yufeng JIN Min MIAO

作者单位: National Key Laboratory of Science and Technology on Micro/Nana Fabrication,Peking University Beijin Inst.of Information Microsystem,Beijing Information Science & Technology University Beijing,P.R.Chin

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 134-137

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）