Effect of nano-dopant on intermetallic compounds growth in Sn-3.0Ag-0.5Cu-xBi solder joints during aging process

摘要：

　　The effect of nano-Bi particles on the growth of intermetallic compound(IMC)between Sn-3.0Ag-0.5Cu-xBi(x=0.0,0.8,1.5,2.5,3.5,and 4.5 wt.%)solder and Cu substrate during aging process at temperatures of 120,150,and 190℃ has been investigated in this study.Scanning electron microscopy(SEM)was used to observe the microstructural evolution of the solder joints and measure the thickness of IMC layer.Energy dispersive X-ray(EDX)was adopted to identify the composite of the IMC phase.The activation energies and growth rates of the IMC layer were determined.Results show that adding nano-Bi into Sn-3.0Ag-0.5Cu solder can increase activation energy and thus reduce the atomic diffusion rate,so as to suppress the excessive growth of the IMC layer.The solder joints containing about 0.8wt.%nano-Bi has the highest activation energy and the lowest growth rate.SEM images reveal that with an increase in nano-Bi to 0.8 wt.%,the number of small particles precipitated along grain boundary reaches maximum.Based on the observation of the microstructural evolution of the solder joints,a grain boundary pinning mechanism for inhibition of the IMC grow due to nano-Bi addition is proposed.

关键词： lead-free solder nano-dopant intermetallic growth activation energy

作者: Y.Tang B.Zhou J.H.Huang Z.Z.Wu G.Y.Li

作者单位: School of Electronic and Information Engineering,South China University of Technology,Guangzhou,Chin Science and Technology on Reliability Physics and Application Technology of Electronic Component Lab School of Electronic and Information Engineering,South China University of Technology,Guangzhou,Chin

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 141-144

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）