Reactive wetting and dewetting of liquid SnPb solder on the butterfly pattern

摘要：

　　The sputter-deposited Cu thin film,coated with a thinner gold layer,was prepared into the butterfly pattern with alternating zones beween Cu thin film and Si.The eutectic SnPb solder balls with different sizes were reflowed on the butterfly pattern.As a result,the liquid solder would be selectively retained on the Au/Cu film zones.At the same time,under the energy minimization control,the liquid solder would dewet from the unwettable Si zones.Especially,for a fixed size pattern,the different reactive wetting and dewetting behavior would happen with the solder ball size changing.

关键词： pattern reactive wetting dewettig solder spreading

作者: W.Liu P.Jin S.D.Zhang

作者单位: Shenzhen Graduate School of Peking University Shenzhen,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 159-162

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）