Improving the Thermal and Mechanical properties of Epoxy Resins for Electronic Packaging

摘要：

　　An epoxy resin with liquid crystal aromatic esters of epoxy resin(TPBDER)used as modifier of epoxy resin was synthesized form 4-Hydroxy benzoic acid,4,4-Dihydroxydiphenyl,epichlorohydrin(ECH).Epoxy resin(ER)was modified by TPBDER for improving both thermal and mechanical properties of electronic packaging materials.The TPBDER modified epoxy was cured with amino-teminated polyoxypropylene D230 and isophorone diamine(IPDA).The thermal properties,liquid crystalline properties of the cured materials were studied by dynamic mechanical analysis(DMA)and differential scanning calorimetry(DSC).The effects of TPBDER loading on dynamic mechanical properties and thermal conductivity of the resins were examined.The results show that TPBDER crystal transition exists near the temperature between 150℃ and 170℃.The TPBDER/ER demonstrated goodmechanical and thermal properties.When the loaded TPBDER was 30(wt)%,the thermal conductivity was 0.36W/m.K,is maximally 3 times higher than that of conventional epoxy resins(0.18 W/m.K).

关键词： Synthesis Thermomechanical properties Epoxy resin liquid crystal

作者: Shuang Liang Dayong Gui Wenchuan Zhang Weijian Xiong Jianhong Liu

作者单位: School of Chemistry and Chemical Engineering,Shenzhen University,Shenzhen,Guangdong 518060,P.R.China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 191-195

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）