Effects of Cu orientation and stand-off-height on the microstructure of Cu/SnAgCu interface

摘要：

　　The effects of Cu orientation and stand-off-height on the microstructure and growth of IMCs in Cu/SnAgCu/Cu solder joints was investigated.Cu6Sn5 and Cu3Sn were the two key intermetallic compounds(IMCs)that formed at the interface.On(111)Cu substrate,prism-like Cu6Sn5 grains could be observed after reflowing at 250℃ for 10s.On polycrystalline Cu substrate,only scallop-like Cu6Sn5 grains formed and the grain size is smaller than that of(111)Cu.Then,samples were aged at 150℃ and the thickness of Cu6Sn5 and Cu3Sn layers increased with the increasing aging time.We found that Cu3Sn formed on(111)Cu substrate grew faster than that on polycrystalline Cu substrate,owing to Cu3Sn columnar growth on(111)Cu and grain boundary diffusion control.After aging at 150℃ for 384 h,the IMC growing from the upper side and from the lower side touched each other in solder joints with 10 μm SOH.Cu6Sn5 stopped growing while Cu3Sn continued growing at the consumption of Cu6Sn5,resulting in the decrease of thickness of Cu6Sn5.

关键词： Cu-Sn intermetallics orientation diffusion

作者: Han Xiao Li Peng Jiaxing Liang Anmin Hu Ming Li

作者单位: State Key Laboratory of Metal Matrix Composites,School of Material Science and Engineering,Shanghai Shanghai Entry-Exit Inspection and Quarantine Bureau,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 205-208

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）