Analysis of Stress and Strain Distribution on Pad During Bump Bonding Process

摘要：

　　The finite element model of bump bonding is built and loads with conditions of bonding time,bonding pressure and bonding power at the same time,and the stress and strain analysis of the pad will take place using this bump bonding finite element model.The result show that: the stress and strain distribution of the pad is not even and increasing with the time,the largest stress and strain all locate the bonding edge,meanwhile,the small stress and strain all locate the bonding centre and basically remain unchanged in the bonding process,a stress and strain gradient from the bonding centre to the bonding edge appear in the pad.The distribution of stress and strain of pad is reflected from the bump bonding conditions.

关键词： bump bonding pad stress strain

作者: Tang Wenliang Huang Chunyue Li Tianming Liang Ying Xiong Guoji Wu song Li Chunquan Ning Zhongping

作者单位: School of Electro-Mechanical Engineering,Guilin University of Electronic Technology,Guilin 541004,Ch Department of Automobile and Power Engineering,Guilin University of Aerospace Technology,Guilin 5410 Department of Electronic Engineering,Chengdu Aeronautic Vocational and Technical College,Chengdu 610

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 219-222

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）