Dealloyed nanoporous Cu films on ceramic substrate for low temperature bonding

摘要：

　　To realize low temperature thermocompression bonding for 3D packaging and integration is of great significance.This research focuses on Cu-Cu low temperature thermocompression bonding using nanoporous copper films(NPCf)as bonding layer.Cu-Zn alloy as the precursor alloy was fabricated on the ceramic substrate by means of heating-alloy method,then the precursor alloy was immersed into the dilute hydrochloric acid for selective corrosion.Three dimensional bi-continuous nanoporous copper film with ligaments and pores size of 25~65 nm were prepared on the substrate.Nanoindentor was used to study the mechanical properties of NPCf.The results show that the hardness and Youngs modulus of NPCf is far less than that of bulk copper material.Bonding experiments were conducted between two ceramic substrates with NPCf as bonding intermediate.Successful bonding were carried out under the conditions at temperature 250℃and pressure 20 Mpa for 2 h.From uniaxial tensile tests for different samples with and without NPCf structure,it can be found that bonded samples with NPCf have higher bonding strength up to 5 Mpa.

关键词： nanoporous copper (NPC) dealloying corrosion low temperature bonding thermocompression bonding nanoindentation

作者: Xiaogang Liu Kecheng Li Mingxiang Chen Sheng Liu

作者单位: Institute for Microsystems,School of Mechanical Science & Engineering,Huazhong University of Science School of Power & Mechanical Engineering,Wuhan University,Wuhan,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 223-226

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）