Reliability of Sn-Pb solder joints with Cu and Co-P surface finishes under thermal cycling

摘要：

　　In this work,ball grid array(BGA)Sn–Pb solder joints on Co–P(4±0.5 at.%P and 8±0.8 at.%P)and Cu substrates were investigated to clarify the effects of interfacial reaction and morphology on the shear strength of the joints during thermal cycling.The interfacial intermetallic compounds(IMCs)in the solder joints were observed by back–scattered electron scanning electron microscopy.The composition of Co–P finishes and IMCs was determined by energy dispersive spectroscopy.The shear strength of Sn–Pb/Cu and Sn–Pb/Co–P solder joints was obtained by ball shear testing.The results showed that Co-P surface finishes retarded the formation of IMCs at the interface as compared with Cu finish.The shear strength of Sn–Pb/Co– 4%P solder joints was slightly lower than that of Sn–Pb/Cu joints after thermal cycling,whereas the Sn–Pb/Co–8%P solder joints exhibited the highest shear strength.The fracture mode of all three kinds of joints was ductile mode.The experimental data showed that Co–8%P could be a good surface finish used in BGA packages.

关键词： Sn-Pb solder joints Co-P surface finish shear strength thermal cycling

作者: Donghua Yang Guoshuai Yang Jian Cai Qian Wang Yang Hu Jingwei Li Liangliang Li

作者单位: Key Laboratory of Advanced Materials(MOE),School of Materials Science and Engineering,Tsinghua Unive Institute of Microelectronics,Tsinghua University,Beijing 100084,China;Tsinghua National Laboratory Institute of Microelectronics,Tsinghua University,Beijing 100084,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 239-242

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）