Preparation, microstructure and properties of Sn-Ag-Cu solder reinforced with Al2O3 nanoparticles

摘要：

　　Sn3.0Ag0.5Cu(SAC)-XAl2O3(X = 0.2,0.4,0.6,0.8 wt.%)composite solders reinforced with Al2O3 nanoparticles were prepared through the powder metallurgy route(ball milling,compacting and sintering).After ball milling,the morphology of composite powder was studied by scanning electron microscopy(SEM).In addition,the prepared composite solders were characterized in terms of their microstructure,wettability and microhardness.After mixing by ball milling,the Al2O3 nanoparticles were found embedded into the surface of Sn-Ag-Cu solder powder.Moreover,microstructure observation proved Al2O3 nanoparticles were successfully incorporated into the SAC solder.Finer microstructure with smaller β-Sn grains was achieved with the addition of Al2O3 nanoparticles.On the other hand,wettability was improved by moderate addition of Al2O3 nanoparticles.12.6%decrease in contact angle was achieved with 0.4 wt.%Al2O3 nanoparticles addition.Microhardness of composite solders increased with the increasing content of Al2O3 nanoparticles.This improved mechanical property can be attributed to the refined microstructure and the dispersed Al2O3 nanoparticles.

关键词： composite solder Al2O3 nanoparticles microstructure wettability microhardness

作者: Bomin Huang Guang Chen Fengshun Wu Weisheng Xia Liping Mo Hui Liu

作者单位: College of Materials Science and Engineering Huazhong University of Science and Technology Wuhan 430074,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 243-246

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）