Study of Electrical and Physical Properties of PrxAl2-xO3 as Metal-oxide-semiconductor Gate Dielectric
The electrical and physical properties of PrxAl2-xO3 on metal-oxide-semiconductor gate dielectric were investigated.Amorphous PrxAl2-xO3 films with the thickness of 15 nm were deposited by electron-beam evaporation under a typical dielectric constant and equivalent oxide thickness of 18 and 3.3 nm,respectively.Leakage current decreased from 48mA/cm2 to 3.4mA/cm2 at a gate voltage of 1V after 500 0C annealing.The films still remained amorphous after 900 0C annealing for 5 min.A mixture of Pr,Al,O and Si observed at the interface between the film and the substrate was argued to be Pr-Al-silicate.Post-annealing is demonstrated to be essential for the films in order to get good electrical property.
PrxAl2-xO3 high-k gate dielectrics CMOS integration electron-beam evaporation
Ziming Zhang Huiqin Ling Ming Li
The State Key Laboratory of the Metal Matrix Composites School of Materials Science and Engineering Shanghai Jiao Tong University Shanghai,P.R.China
国际会议
The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)
成都
英文
266-269
2014-08-12(万方平台首次上网日期,不代表论文的发表时间)