Preparation of direct plated copper ceramic spreader using electroless copper as seed layer

摘要：

　　Electroless copper plating has attracted more and more interests as an effective process for metalizing ceramic surface.Direct plated copper(DPC)ceramic spreader has been widely used for high-power LED packing.Usually,preparation of DPC used sputtering Ti/Cu for seed layer following by thick copper plating.In this work,DPC fabrication was optimized by applying the electroless plating copper as seed layer.The orthogonal experiment,single-factor analysis and other methods were used to optimize the electroless copper plating process,and the coating properties were evaluated by tensile test,scanning electron microscope(SEM)and energy dispersive spectrometer(EDS).

关键词： Direct plated copper(DPC) electroless copper plating orthogonal experiment LED packaging

作者: Ziliang Hao Xuebin Zhang Chen Chen Mingxiang Chen

作者单位: School of Mechanical Science and Engineering,HUST,Wuhan 430074,China School of Energy and Power Engineering,HUST,Wuhan 430074,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 292-295

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）