Effect of SiC Whiskers Addition on Microstructure, Microhardness and Wettablility of Sn-Ag-Cu Solder

摘要：

　　A novel SiC doped SAC305 composite solder was developed by mechanically mixing various amount of the SiC whiskers with Sn-3.0Ag-0.5Cu solder paste.The effect of SiC whiskers addition on microstructure,microhardness and wettability of the composite solders was investigated.It was found that the eutectic structure was refined in the composite solder,and both of the microhardness and wettability of the composite solders were improved.Specifically,0.1 wt.%of SiC whiskers addition in composite solder lead to 29.2%increase in hardness while 0.2 wt.%of SiC whiskers addition cause a 6.3%decrease in the contact angle.

关键词： Composite solder Microstructure Microhardness Wettability

作者: Kaisheng Xu Guang Chen Fengshun Wu Weisheng Xia Hui Liu

作者单位: College of Materials Science and Engineering Huazhong University of Science and Technology Wuhan,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 310-312

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）