Mechanical property and void ratio of several Pb-containing and Pb-free solder joints in space power electronics

摘要：

　　The shearing strength and the void ratio of serial solder joints are discussed in this paper.Pb-containing solders,Sn-90Pb、Sn-95Pb、Sn-37Pb and Sn-3.0Ag-0.5Cu Pb-free are soldered with Mocu substrate using vacuum soldering.Results show that,Sn-90Pb、Sn-95Pb solder joints have many voids in the joint interface,and resulting low shearing strength.Sn-37Pb and Sn-3.0Ag-0.5Cu solder joints have less voids and larger shearing strength.The Sn-3.0Ag-0.5Cu solder joint has the largest shear strength in all those 4 kinds of solders.

作者: Yarong Chen Zongpeng He Zhenming Zhang Meng Yang Rong An

作者单位: Beijing spacecrafts Harbin Institute of Technology No.104,youyi road,haidian district,Beijing,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 340-342

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）