Assembly process research of TO package power transistor in Aerospace electronic products

摘要：

　　In this paper,two processes which are adopted to produce TO packaged power devices are concerned about.The relationship between process factors and equivalent stress and deformation in the joint are studied.Finite element simulation method is adopted to analyze the equivalent stress,strain and deformation in the two processes.Results indicate that both the two processes produce large equivalent stresses,which are over 180MPa.The peak stress locates at the root of contact area of leg and pipe.On the whole,welding stress of process A is larger due to the relatively larger mechanical restraint.To improve the long term reliability for the TO package products,here we put forward a new process,by which smaller equivalent stress is produced.

作者: Ningning Wang Qiong Wu Zongpeng He Zhenming Zhang Wei Zhang

作者单位: Room B415,Beijing Spacecrafts,China Academy of Space Technology 104,Youyi Road,Haidian,Beijing,P.R.C Electronics Packaging Lab,School of Materials Science and Engineering,Harbin Institute of Technology

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 343-346

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）