The study of novel Metal/Composite thermal interface materials for chip testing

摘要：

　　Thermal interface materials(TIMs)which consist of metal foil and soft cushion are used in the process of chip processor platform validation(PPV)process,and some defects,such as the stains caused by debris peeled off from TIMs due to stress concentration,were found on the surface of the chips and they had an hazardous influence in the testing process.As well as that,the thermal resistance of TIMs is also a crucial issue that deserves to be further studied.To solve these problems,not only the metal layers in TIMs with less contamination are needed to be chosen,but also TIMs with higher thermal conductivity are needed to be developed.In this paper,Finite element method(FEM)was employed to evaluate the stress concentration area,where the debris were normally observed.And different kinds of composite were fabricated in a mould and tested in the PPV detection system.Simulation results showed that the stress concentration area is located at the contacted position between Al foil and chip,where the maximum stress and strain is 3.03×107Pa and 9.379×10-3 respectively.In addition,four different kinds of TIMs were fabricated and tested in the PPV system.It was found that the copper/soft cushion is the potential TIMs.

关键词： thermal interface materials (TIMs) processor platform validation (PPV) stain thermal conductivity finite element method

作者: Wang Shen Cai Xionghui Chen Guang Wu Fengshun Xia Weishen Zhu Wenbo Liu Ruhua Zhang Yi

作者单位: College of Material Science and Technology Huazhong University of Science and Technology Wuhan,China Research Department of Test Engineering Intel(Chengdu)Products Co.,Ltd Chengdu,China

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 352-355

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）